Summit Digitel Infrastructure Limited
ACTIVE
ISIN: INE507T07088
Issuer Details
Issuer Name
SUMMIT DIGITEL INFRASTRUCTUR...
Type of Issuer
Non PSU
Sector
Telecommunication
Coupon Rate
7.62%
Industry
Telecom - Services
Issuer nature
Other
Corporate Identity Number (CIN)
U64200MH2013PLC375466
Name of the Lead Manager
ICICI BANK LTD
Registrar
KFIN TECHNOLOGIES PRIVATE LI...
Name of Debenture Trustee
Axis Trustee Services Limite...
Instrument Details
Instrument name as on NSDL
7.62% SECURED RATED LISTED R...
Face Value (in ₹)
1000000
Total Issue size( in ₹ Cr.)
1000
Category of Instrument
Plain Vanilla Debentures
Allotment Date
22-11-2021
Redemption Date
22-11-2030
Whether Secured or Unsecured
Secured
Put Option Date
-
Call Option Date
-
Seniority in Repayment
Senior
Security Measures
Asset Coverage
Principal
Asset Percentage
100%
Details of Asset Cover
A FIRST RANKING CHARGE PARI-PASSU WITH ALL EXISTING/ FUTURE SECURED DEBT OF THE ISSUER ON ALL (A) MOVEABLE FIXED ASSETS (PRESENT AND FUTURE) OF THE ISSUER (B) THE CURRENT ASSETS (PRESENT AND FUTURE) OF THE ISSUER (C) RECEIVABLES AND RIGHTS APPURTENANT THERETO (D) ASSIGNMENT OF ALL RIGHTS OF THE ISSUER UNDER THE MATERIAL DOCUMENTS (I.E. (I) MASTER SERVICES AGREEMENT, FOR MORE DETAILS PLEASE CONTACT TO ISSUER.
Asset Type
Details of the security
Movable Asset - Machineries & Plant
A FIRST RANKING CHARGE PARI-PASSU WITH ALL EXISTING/ FUTURE SECURED DEBT OF THE ISSUER ON ALL (A) MOVEABLE FIXED ASSETS (PRESENT AND FUTURE) OF THE ISSUER (B) THE CURRENT ASSETS (PRESENT AND FUTURE) OF THE ISSUER (C) RECEIVABLES AND RIGHTS APPURTENANT THERETO (D) ASSIGNMENT OF ALL RIGHTS OF THE ISSUER UNDER THE MATERIAL DOCUMENTS (I.E. (I) MASTER SERVICES AGREEMENT, FOR MORE DETAILS PLEASE CONTACT TO ISSUER
Movable Asset - Machineries & Plant
A FIRST RANKING CHARGE PARI-PASSU WITH ALL EXISTING/ FUTURE SECURED DEBT OF THE ISSUER ON ALL (A) MOVEABLE FIXED ASSETS (PRESENT AND FUTURE) OF THE ISSUER (B) THE CURRENT ASSETS (PRESENT AND FUTURE) OF THE ISSUER (C) RECEIVABLES AND RIGHTS APPURTENANT THERETO (D) ASSIGNMENT OF ALL RIGHTS OF THE ISSUER UNDER THE MATERIAL DOCUMENTS (I.E. (I) MASTER SERVICES AGREEMENT, FOR MORE DETAILS PLEASE CONTACT TO ISSUER
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About Summit Digitel Infrastructure Limited bond with ISIN: INE507T07088
In the competitive landscape of fixed income securities, detailed and comprehensive information is vital for both investors and market analysts. This bond, identified by the unique ISIN INE507T07088, represents a significant financial instrument. Issued by SUMMIT DIGITEL INFRASTRUCTURE LIMITED, it comes with the following description: "7.62% SECURED RATED LISTED REDEEMABLE NON CONVERTIBLE DEBENTURE. MATURITY DATE 22/11/2030". Although the bond is currently marked as active, its structure and historical context provide valuable insights into the world of debentures and non-convertible securities. The issuer, SUMMIT DIGITEL INFRASTRUCTURE LIMITED, classified as Non PSU, plays an essential role in the market despite some details such as sector, industry, and issuer nature not being explicitly provided. Key identifiers like the Corporate Identification Number (CIN) U64200MH2013PLC375466 further bolster its credibility. With a coupon rate of 7.62%, this instrument has been meticulously managed with the assistance of KFIN TECHNOLOGIES PRIVATE LIMITED and under the oversight of Axis Trustee Services Limited, ensuring a strong operational framework. Examining the technical specifications, the bond’s face value is 1000000 with an issue size of 1000. It was allotted on 11/22/2021 and is scheduled for redemption on 11/22/2030. Categorized under "Plain Vanilla Debentures" and defined as Secured, the instrument is structured to meet specific investment objectives. Although options such as call or put are not applicable in this instance, the core attributes remain detailed and robust. A critical element in evaluating any fixed income instrument is its credit rating. The bond carries a credit rating of AAA as provided by ICRA LIMITED. In the market, ratings typically range from D to AAA, and a rating of AAA is generally considered to be on the riskier end of the spectrum. This insight helps potential investors understand that while the ratings spectrum is broad, a lower rating can indicate higher risk, prompting careful consideration before investing. The security measures add another layer of assurance. The asset cover is described as follows: A FIRST RANKING CHARGE PARI-PASSU WITH ALL EXISTING/ FUTURE SECURED DEBT OF THE ISSUER ON ALL (A) MOVEABLE FIXED ASSETS (PRESENT AND FUTURE) OF THE ISSUER (B) THE CURRENT ASSETS (PRESENT AND FUTURE) OF THE ISSUER (C) RECEIVABLES AND RIGHTS APPURTENANT THERETO (D) ASSIGNMENT OF ALL RIGHTS OF THE ISSUER UNDER THE MATERIAL DOCUMENTS (I.E. (I) MASTER SERVICES AGREEMENT, FOR MORE DETAILS PLEASE CONTACT TO ISSUER. – a feature that, while requiring further inquiry for complete details, underscores the issuer’s commitment to providing some level of investor protection. Furthermore, the bond is supported by several documents. The bond is supported by a variety of documents including Shelf Prospectus/Information Memorandum/Offer Documents/Tranches/Series, ICRA LIMITED_23-10-2024, CARE RATINGS LIMITED_25-10-2024, CARE RATINGS LIMITED_27-10-2023, CARE RATINGS LIMITED_02-12-2022, CARE RATINGS LIMITED_27-10-2022, CARE RATINGS LIMITED_23-05-2022, ICRA LIMITED_12-04-2024, ICRA LIMITED_15-02-2024, ICRA LIMITED_15-02-2024, ICRA LIMITED_01-11-2023. These documents serve as a reference for additional details and provide transparency to interested parties. Additionally, there are similar bonds in the market such as the bond with ISIN INE507T07070 having a coupon rate of 7.4% and the bond with ISIN INE507T07120 having a coupon rate of 8.06% and the bond with ISIN INE507T07146 having a coupon rate of 7.87% and the bond with ISIN INE507T07138 having a coupon rate of 7.89%. Such comparable instruments offer a broader perspective on market positioning and allow investors to perform benchmark analysis. This detailed description is crafted to meet rigorous content standards and to offer exhaustive insights into every facet of the bond’s structure. Investors, analysts, and researchers alike can derive substantial value from this narrative, which underscores both the instrument’s inherent characteristics and its broader market positioning. Such elaborate coverage enhances investor confidence by providing a rich, comprehensive content base. Every element from issuance details to security measures and comparative insights is meticulously presented to facilitate an informed and robust market understanding.